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A Unique Process: Flender Uses Waste Heat from Its In-house Hardening Facility to Heat Buildings

  • November 14, 2024
  • News

Flender CEO Andreas Evertz: "We have a significant responsibility to society and our climate to make our production as sustainable as possible." 

Beckhoff Strengthens Packaging Industry Team in the US and Globally

  • November 13, 2024
  • News

Greg Marsh will take over as Packaging industry manager, while Mark Ruberg is elevated to focus on end users with Beckhoff’s global packaging team.

Nefab Expands in Arizona with New Tucson Facility

  • November 13, 2024
  • News

Nefab has made a multi-million-dollar investment in a new 140,000-square-foot facility in Tucson, Arizona, creating 100 new jobs and contributing to local economic development.

ISA Position Paper Explores How to Advance Precision Agriculture Through Automation

  • November 12, 2024
  • News

The International Society of Automation (ISA) has announced the publication of a new position paper: “Advancing Precision Agriculture Through Control System Technologies.”

Flender Celebrates 125th Anniversary at Its New Plant in India

  • November 12, 2024
  • News

The anniversary celebration was hosted by Mr. Vinod Shetty, Flender India CEO.

ABB Drive Modernization Gives NASA’s Wind Tunnel a New Lease of Life

  • November 12, 2024
  • News

ABB has upgraded a variable speed drive to extend the life of NASA’s National Transonic Facility (NTF) wind tunnel by at least 10 years.

MSU’s Food Lab on Wheels Expands Food Processing Training Opportunities Across Michigan

  • November 12, 2024
  • News

The tractor trailer based mobile lab replicates the many processes future food production supervisors will manage.

KUKA Robotics Highlighted Fast and Precise Automated Bottle Capping at Pack Expo 2024

  • November 8, 2024
  • News

During PACK EXPO 2024, KUKA Robotics showed the speed and precision of an automated bottle capping solution that uses two KR 6 R500 Z200-2 SCARA robots.

Emerson Showcases Packaging Solutions Advance Future of Automation at PACK EXPO 2024

  • November 7, 2024
  • News

Global technology, software and engineering leader Emerson exhibited its latest Floor to Cloud packaging solutions at PACK EXPO in Chicago, Nov. 3-6, 2024.

Next-Gen Designers Tackle Sustainable Packaging Challenges in Nefab's 2024 Competition

  • November 6, 2024
  • News

Students from SJSU’s Packaging Degree program were invited to develop innovative, sustainable packaging solutions for Cloud Network Routers, a crucial component in cloud networking infrastructure.